| Phase Change Material | HP-60 | Unit | Test Standard |
| Thermal Conductivity | 6.0 | W/mk | ASTM D5470 |
| Color | Gray | ——— | ——— |
| Thickness | 0.25-1.0 | mm | ——— |
| Density | 2.7 | g/cm³ | ASTM D374 |
| Phase Change Temperature | 50-60 | °C | ASTM D3418 |
| Thermal Resistance (50psi@0.3mm) | ≤0.1 | °C·in²/W | ASTM D5470 |
| Dielectric Strength | >3.0 | KV | ASTM D149 |
| Operating Temperature | -40~125 | °C | ——— |
Phase Change Material HP-60 6.0W
Features
- High thermal conductivity
- Good electrical insulation
- Excellent surface wetting
- Excellent reliability
Phase Change Material (PCM) is a solid sheet at room temperature, making it easy to cut and assemble. Once the component heats up to the phase change temperature, the material softens and flows to fully fill the microscopic gaps between the heat source and the heatsink, greatly reducing interface thermal resistance for fast heat dissipation.
Selection Guide
High-conductivity model: 6.0 W/mK and thermal resistance ≤0.1 °C·in²/W, for high-power chips such as GPUs and server CPUs. Dielectric strength is >3 kV; where higher electrical insulation is required, choose HP-85.
Applications
5G, electric vehicles, power supplies, servers, notebooks, desktops, CPUs, ICs, wireless hubs, LEDs, motherboards, heatsinks, LCD TVs, telecom equipment, AIoT and more.
