| Phase Change Material | HP-85 | Unit | Test Standard |
| Thermal Conductivity | 8.5 | W/mk | ASTM D5470 |
| Color | Gray | ——— | ——— |
| Thickness | 0.25-1.0 | mm | ——— |
| Density | 2.4 | g/cm³ | ASTM D374 |
| Phase Change Temperature | 50-60 | °C | ASTM D3418 |
| Thermal Resistance (50psi@0.3mm) | ≤0.05 | °C·in²/W | ASTM D5470 |
| Dielectric Strength | >8.0 | KV | ASTM D149 |
| Operating Temperature | -40~125 | °C | ——— |
Phase Change Material HP-85 8.5W
Features
- High thermal conductivity
- Good electrical insulation
- Excellent surface wetting
- Excellent reliability
Phase Change Material (PCM) is a solid sheet at room temperature, making it easy to cut and assemble. Once the component heats up to the phase change temperature, the material softens and flows to fully fill the microscopic gaps between the heat source and the heatsink, greatly reducing interface thermal resistance for fast heat dissipation.
Selection Guide
Flagship of the series: 8.5 W/mK with the lowest thermal resistance (≤0.05 °C·in²/W) while keeping >8 kV dielectric strength. Ideal for AI server GPUs/ASICs, IGBT power modules and automotive electronics.
Applications
5G, electric vehicles, power supplies, servers, notebooks, desktops, CPUs, ICs, wireless hubs, LEDs, motherboards, heatsinks, LCD TVs, telecom equipment, AIoT and more.
