| Graphene Pad | GW-6 | Unit | Test Standard |
| Color | Grey | — | — |
| Thickness | 0.3 | mm | — |
| Resilience | >60 | % | ASTM D575 |
| Density | <0.95 | g/cc | ASTM D792 |
| Thermal Resistance @40psi | <0.06 | ℃·cm²/W | ASTM D5470 |
| Temperature Range | -40 ~ 150 | ℃ | IEC 60068-2-14 |
| Compressive Stress @50% | <180 | psi | ASTM D575 |
| Tensile Strength | ≧0.03 | MPa | ASTM D412 |
Graphene Pad GW-6
Features
- High-performance compression
- Low thermal resistance
- Low density
- Ultra-high thermal conductivity
Graphene Pad offers ultra-high thermal conductivity and low thermal resistance with good compression and rebound properties, conforming closely to the interface between heat-generating components and heatsinks to effectively improve heat dissipation.
Selection Guide
Lowest thermal resistance in the series (<0.06 ℃·cm²/W), for the hottest GPUs and processors, and able to handle higher assembly pressure.
Applications
5G, electric vehicles, power supplies, servers, notebooks, desktops, CPUs, ICs, wireless hubs, LEDs, motherboards, heatsinks, LCD TVs, telecom equipment, AIoT and more.
