| Graphene Pad | GW-10 | Unit | Test Standard |
| Color | Grey | — | — |
| Thickness | 0.3 | mm | — |
| Resilience | >60 | % | ASTM D575 |
| Density | <0.95 | g/cc | ASTM D792 |
| Thermal Resistance @40psi | <0.1 | ℃·cm²/W | ASTM D5470 |
| Temperature Range | -40 ~ 150 | ℃ | IEC 60068-2-14 |
| Compressive Stress @50% | <60 | psi | ASTM D575 |
| Tensile Strength | ≧0.025 | MPa | ASTM D412 |
Graphene Pad GW-10
Features
- High-performance compression
- Low thermal resistance
- Low density
- Ultra-high thermal conductivity
Graphene Pad offers ultra-high thermal conductivity and low thermal resistance with good compression and rebound properties, conforming closely to the interface between heat-generating components and heatsinks to effectively improve heat dissipation.
Selection Guide
Low-stress model: compression stress <60 psi at 50% and thermal resistance <0.1 ℃·cm²/W, balancing heat dissipation and component protection. Suited to BGA packages and pressure-sensitive modules.
Applications
5G, electric vehicles, power supplies, servers, notebooks, desktops, CPUs, ICs, wireless hubs, LEDs, motherboards, heatsinks, LCD TVs, telecom equipment, AIoT and more.
