|
|
SG-35 | Unit | Test method |
| Thermal conductivity | 3.5 | W/mk |
ASTM D5470 |
|
Color |
White/Blue | ——— | ——— |
| Weight Loss | <0.1 | % |
ASTM E595-07 |
|
Bleed rate |
<1 | H | 125°C/48H |
| Curing time | <24 | H |
Adjustment |
|
Insulation Strength |
>6.0 | KV | ASTM D149 |
| Working temperature | -40~150 | °C |
——— |
|
|
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Thermal Gel 3.5W
Features
- High Thermal Conductivity
- Easy Assembly Process
- Excellent Compressibility
- Natural Tackiness and Adhesion
Thermal Gel is a high-performance thermal interface material (TIM) designed to fill gaps between heat-generating components and heat-dissipating devices. Its soft and conformable characteristics allow it to effectively eliminate air gaps and surface irregularities, reducing thermal resistance and improving heat transfer efficiency.
Application
5G Communication Equipment, Electric Vehicles (EV), Power Supplies, Servers, Notebooks, PCs, CPUs, ICs, Wireless Hubs, LED Lighting, Motherboards, Heat Sinks, LCD TVs, Telecommunications Equipment, AIoT Devices, Data Centers, Industrial Electronics, Semiconductor Devices, and Artificial Intelligence (AI) Systems.
