| Thermal Paste | Unit |
TEST |
|
|
Thermal Conductivity |
5.0 | W/mk | ASTM D5470 |
|
Color |
Grey | ——— |
Visual |
|
Special gravity |
2.9 | g/cm3 |
ASTM D1475 |
|
Thermal impedance |
0.015-0.02 | ℃-in2/W |
ASTM D5470 |
|
Penetration |
290 | mm | ASTM D217 |
| Oil separation | <0.1 | % |
24 hrs at 150℃ |
|
Volatile component |
0.1 | % | 240hrs at 1000C |
| Operating Temperature | -50~150 | C |
————– |
Thermal Paste 5.0W
Feature
- Not easy to harden
- High stability
- Easy to assemble
- High thermal conductive
Thermal paste is a material used to enhance heat transfer, typically employed in electronic components and computer hardware. Its primary purpose is to serve as a filler material, reducing the resistance to heat transfer and significantly improving thermal dissipation efficiency.
Application
5G, Electric Vehicles, Power Supply, Server,NB,PC, CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.
