|
Thermal Paste |
CG-20 | Unit | TEST |
|
Thermal Conductivity |
2.0 | W/mk | ASTM D5470 |
|
Color |
White | ——— | Visual |
|
Viscosity@25c |
1850 | kcps |
AMG Test method |
| Thermal resistance | 0.025 | ℃-in2/W |
ASTM D2240 |
|
Insulation Strength |
>6.0 | KV |
ASTM D149 |
| Operating Temperature | -50~150 | C | ————– |
Thermal Paste 2.0W
Feature
- Not easy to harden
- High stability
- Easy to assemble
- High thermal conductive
Thermal paste is a material used to enhance heat transfer, typically employed in electronic components and computer hardware. Its primary purpose is to serve as a filler material, reducing the resistance to heat transfer and significantly improving thermal dissipation efficiency.
Application
5G, Electric Vehicles, Power Supply, Server,NB,PC, CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.
