|
|
SP-25 | Unit | Test |
| Thermal Conductivity | 2.1 | W/mk |
ASTM D5470 |
|
Color |
Green | ——— | ——— |
| Thickness | 0.25~10 | mm |
ASTM D374 |
|
Special gravity |
2.0±0.2 | g/cm3 | ASTM D792 |
| Hardness | 18±3 | Shore A |
ASTM D2240 |
|
Tensile Strength |
13±3 | Kgf/cm2 | ASTM D412 |
| Elongation | <1 | % |
ASTM D412 |
|
Insulation Strength |
>6.0 | KV | ASTM D149 |
| Operating Temperature | -45~200 | C |
——— |
|
standard thickness = 1mm |
|||
Thermal Pad 2.0W
Feature
- Thermal conductive
- Easy to assemble
- Good compressibility
- Natural tack
Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling
Application
5G, Electric Vehicles, Power Supply, Server,NB,PC, CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.
