Thermal Pad 2.0W

Feature

  • Thermal conductive
  • Easy to assemble
  • Good compressibility
  • Natural tack

Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling

Application

5G, Electric Vehicles, Power Supply, Server,NB,PC,  CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.

Category:

 

SP-25 Unit Test
Thermal Conductivity 2.1 W/mk

ASTM D5470

Color

Green ——— ———
Thickness 0.25~10 mm

ASTM D374

Special gravity

2.0±0.2 g/cm3 ASTM D792
Hardness 18±3 Shore A

ASTM D2240

Tensile Strength

13±3 Kgf/cm2 ASTM D412
Elongation <1 %

ASTM D412

Insulation Strength

>6.0 KV ASTM D149
Operating Temperature -45~200 C

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standard thickness = 1mm