SP-15 |
UNIT | TEST | |
THERMAL CONDUCTIVITY | 1.5 | W/mk |
ASTM D5470 |
COLOR |
Purple/Light Red | ——— | ——— |
THICKNESS | 0.25~10 | mm |
ASTM D374 |
SPECIAL GRAVITY |
2.3 | g/cm3 | ASTM D792 |
HARDNESS | 20 | Shore 00 |
ASTM D2240 |
Relative Permittivity |
5.3 | 1 MHz | ASTM D150 |
Volume Resistivity | 10^12 | Ω·cm |
ASTM D257 |
INSULATION STRENGTH |
>6.5 | KV | ASTM D149 |
OPERATING TEMPERATURE | -45~150 | C |
——— |
Standard thickness = 1mm |
Thermal Pad 1.5W
Feature
- Thermal conductive
- Easy to assemble
- Good compressibility
- Natural tack
Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling.
Application
5G, Electric Vehicles, Power Supply, Server,NB,PC, CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.
Category: Thermal Pad