Thermal Pad 1.5W

Feature

  • Thermal conductive
  • Easy to assemble
  • Good compressibility
  • Natural tack

Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling.

Application

5G, Electric Vehicles, Power Supply, Server,NB,PC,  CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.

Category:

SP-15

UNIT TEST
THERMAL CONDUCTIVITY 1.5 W/mk

ASTM D5470

COLOR

Purple/Light Red ——— ———
THICKNESS 0.25~10 mm

ASTM D374

SPECIAL GRAVITY

2.3 g/cm3 ASTM D792
HARDNESS 20 Shore 00

ASTM D2240

Relative Permittivity

5.3 1 MHz ASTM D150
Volume Resistivity 10^12 Ω·cm

ASTM D257

INSULATION STRENGTH

>6.5 KV ASTM D149
OPERATING TEMPERATURE -45~150 C

———

Standard thickness = 1mm