Thermal Pad 12.0W

Feature

  • High thermal conductive
  • Easy to assemble
  • Good compressibility
  • Natural tack

Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling

Applications

5G, Electric Vehicles, Power Supply, Server,NB,PC,  CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device,   AIOT, etc.

Category:

 

SP-120 Unit Test
Thermal Conductivity 12 W/mk

ASTM D5470

Color

Grey ——— ———
Thickness 0.5~3.0 mm

ASTM D374

Special gravity

3.6 g/cm3 ASTM D792
Hardness 55 Shore 00

ASTM D2240

Tensile Strength

10 Kgf/cm2 ASTM D412
Elongation 20 %

ASTM D412

Insulation Strength

>10 KV ASTM D149
Operating Temperature -40~200 C

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Standard thickness = 1mm