|
|
SP-70 | Unit | Test |
| Thermal Conductivity | 7.0 | W/mk |
ASTM D5470 |
|
Color |
Green | ——— | ——— |
| Thickness | 0.3~10 | mm |
ASTM D374 |
|
Special gravity |
3.2 | g/cm3 | ASTM D792 |
| Hardness | 30~60 | Shore 00 |
ASTM D2240 |
|
Relative Permittivity |
6.7~7.4 | 1MHz | ASTM D150 |
| Volume Resistivity | 7.26*10^13 | Ω·cm |
ASTM D257 |
|
Insulation Strength |
>5.0 | KV | ASTM D149 |
| Operating Temperature | -45~150 | C |
——— |
|
standard thickness = 1mm |
|||
Thermal Pad 7.0W
Feature
- Thermal conductive
- Easy to assemble
- Good compressibility
- Natural tack
Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling
Application
5G, Electric Vehicles, Power Supply, Server,NB,PC, CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.
