|
SP-40 | Unit | Test |
Thermal Conductivity | 4.0 | W/mk |
ASTM D5470 |
Color |
Blue | ——— | ——— |
Thickness | 0.3~10 | mm |
ASTM D374 |
Special gravity |
3.0 | g/cm3 | ASTM D792 |
Hardness | 30~70 | Shore 00 |
ASTM D2240 |
Relative Permittivity |
7.3 | 1MHz | ASTM D150 |
Volume Resistivity | 10^13 | Ω·cm |
ASTM D257 |
Insulation Strength |
>6.0 | KV | ASTM D149 |
Operating Temperature | -45~150 | C |
——— |
standard thickness = 1mm |
Thermal Pad 4.0W
Feature
- Thermal conductive
- Easy to assemble
- Good compressibility
- Natural tack
Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling
Application
5G, Electric Vehicles, Power Supply, Server,NB,PC, CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.
Category: Thermal Pad