| SP-170 | Unit | Test | |
| Thermal Conductivity | 17.0 | W/mk | ASTM D5470 |
| Color | Grey | ——— | ——— |
| Thickness | 0.5~3 | mm | ASTM D374 |
| Special gravity | 3.5±0.2 | g/cm3 | ASTM D792 |
| Hardness | 40 | Shore 00 | ASTM D2240 |
| Tensile Strength | 6±3 | Kgf/cm2 | ASTM D412 |
| Elongation | <250±10 | % | ASTM D412 |
| Insulation Strength | >10.0 | KV | ASTM D149 |
| Operating Temperature | -45~200 | C | ——— |
Thermal Pad 17.0W
Feature
- High thermal conductive
- Easy to assemble
- Good compressibility
- Natural tack
Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling
Application
5G, Electric Vehicles, Power Supply, Server,NB,PC, CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.
