|
|
SG-35 | Unit | Test |
| Thermal Conductivity | 3.5 | W/mk |
ASTM D5470 |
|
Color |
Blue/White | ——— | ——— |
| Viscosity | A: 13M B: 13M |
mPa.s |
ASTM D2196@0.2Rpm |
|
Special gravity |
3.3 | g/cm3 | ASTM D792 |
| Weight Loss | <0.1 | % |
ASTM E595-07 |
|
Bleed rate |
<1 | % | 125C/48H |
| Curing time | <24 | H |
Adjust |
|
Insulation Strength |
>6.0 | KV | ASTM D149 |
| Operating Temperature | -45~150 | C |
——— |
|
standard thickness = 1mm |
|||
Thermal Gel 3.5W
Feature
- Thermal conductive
- Easy to assemble
- Good compressibility
- Natural tack
Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling
Application
5G, Electric Vehicles, Power Supply, Server,NB,PC, CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.
