Thermal Putty 2.0W

Feature

  • Good thermal conductive
  • Easy to assemble
  • Good compressibility

Thermal Putty is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling

Application

5G, Electric Vehicles, Power Supply, Server,NB,PC,  CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.

Category:
Thermal Putty 2000P Unit Test
Thermal Conductivity 2.0 W/mk ASTM D5470
Color Grey ——— ———
Special gravity 2.9 g/cm3 ASTM D792
Thermal resistance 0.09 in2/w ASTM D2240
Insulation Strength 4 KV/mm ASTM D149
Operating Temperature -50~150 C ———

Remark

* Silicone and ceramic powder included
* Automated Robot Dispenser can use