Thermal putty is a thermal interface material (TIM) designed to fill gaps between heat-generating components and heat-dissipating devices.
Its soft and highly conformable nature enables it to accommodate uneven surfaces and manufacturing tolerances, improving thermal transfer efficiency and enabling rapid heat dissipation.
Thermal putty helps reduce thermal resistance, enhance system reliability, and maintain optimal operating temperatures in demanding electronic applications.
| Thermal Putty | 40P | Unit | Test method |
| Thermal conductivity | 4.2 | W/mk | ASTM D5470 |
| Color | Pink | ——— | ——— |
| Specific Gravity | 3.4 | g/cm3 | ASTM D792 |
| Weight Damnify | <1 | g/min | 125℃/48H |
| Insulation Strength | 6 | KV/mm | ASTM D149 |
| Working Temperature | -40~200 | °C | ——— |
