| Thermal Paste | CG-20 | Unit | Test Standard |
|---|---|---|---|
| Thermal Conductivity | 2.0 | W/mk | ASTM D5470 |
| Color | White | — | Visual |
| Viscosity @25℃ | 1850 | kcps | AMG Test Method |
| Thermal Resistance | 0.025 | ℃-in²/W | ASTM D2240 |
| Insulation Strength | >6.0 | KV | ASTM D149 |
| Operating Temperature | -50~150 | ℃ | — |
Thermal Paste 2.0W
Features
- Non-hardening
- High stability
- Easy to assemble
- High thermal conductivity
Thermal paste is a material used to enhance heat transfer, widely applied in electronic components and computer hardware. Its main use is as a filler material to reduce thermal resistance and significantly improve heat dissipation efficiency.
Application Fields
5G, Electric Vehicles, Power Supplies, Servers, NB, PC, CPU, IC, Wireless Hubs, LED, Motherboards, Heatsinks, LCD-TV, Telecom Equipment, AIOT, etc.
