| Thermal Paste | CG-50 | Unit | Test Standard |
|---|---|---|---|
| Thermal Conductivity | 5.0 | W/mk | ASTM D5470 |
| Color | Grey | — | Visual |
| Specific Gravity | 2.9 | g/cm³ | ASTM D1475 |
| Thermal Resistance | 0.1 | ℃-in²/W | ASTM D5470 |
| Penetration | 290 | mm | ASTM D217 |
| Oil Separation | <0.1 | % | 24 hrs at 150℃ |
| Volatile Content | 0.1 | % | 240hrs at 100℃ |
| Operating Temperature | -50~150 | ℃ | — |
Thermal Paste 5.0W
Features
- Non-hardening
- High stability
- Easy to assemble
- High thermal conductivity
Thermal paste is a material used to enhance heat transfer, widely applied in electronic components and computer hardware. Its main use is as a filler material to reduce thermal resistance and significantly improve heat dissipation efficiency.
Application Fields
5G, Electric Vehicles, Power Supplies, Servers, NB, PC, CPU, IC, Wireless Hubs, LED, Motherboards, Heatsinks, LCD-TV, Telecom Equipment, AIOT, etc.
