|
|
SG-60 | Unit | Test |
| Thermal Conductivity | 6.0 | W/mk |
ASTM D5470 |
|
Color |
White/Red | ——— | ——— |
| Weight Loss | <0.1 | % |
ASTM E595-07 |
|
Bleed rate |
<1 | % | 125°C/48H |
| Curing time | <24 | H |
Adjustment |
|
Insulation Strength |
>6.0 | KV | ASTM D149 |
| Operating Temperature | -40~150 | °C |
——— |
|
|
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Thermal Gel 6.0W
Feature
- Thermal conductive
- Easy to assemble
- Good compressibility
- Natural tack
Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling
Application
5G, Electric Vehicles, Power Supply, Server,NB,PC, CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.
