Thermal Putty 3.0W

Feature

  • Good thermal conductive
  • Easy to assemble
  • Good compressibility

Thermal Putty is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling

Application

5G, Electric Vehicles, Power Supply, Server,NB,PC,  CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.

Category:

 

Thermal Paste 3000P Unit

TEST

Thermal Conductivity

3.0 W/mk ASTM D5470

Color

Green ———

Visual

Special gravity

2.9 g/cm3

ASTM D1475

Weight Loss

<1 %

125℃/ 48H

Breakdown Voltage

>5.0 kV/mm ASTM D149
Operating Temperature -50~200

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Remark

* Silicone and ceramic powder included
* Automated Robot Dispenser can use