Thermal Pad 1.7W

Feature

  • Thermal conductive
  • Easy to assemble
  • Good compressibility
  • Natural tack

Thermal Pad is a type of thermal interface material that can fill gaps between heat-dissipating objects and heat-generating components, enhancing heat conduction efficiency to achieve rapid cooling.

Application

5G, Electric Vehicles, Power Supply, Server,NB,PC,  CPU, IC, Wireless Hub, LED, Mother Board,Heat Sink,LCD-TV,Telecom Device, AIOT, etc.

Category:
 

SP-17

UNIT TEST
THERMAL CONDUCTIVITY 1.7 W/mk

ASTM D5470

COLOR

Purple ——— ———
THICKNESS 0.25~10 mm

ASTM D374

SPECIAL GRAVITY

1.7±0.2 g/cm3 ASTM D792
HARDNESS 15±3 Shore A

ASTM D2240

TENSILE STRENGTH

7±3 Kgf/cm2 ASTM D412
ELONGATION 75±10 %

ASTM D412

INSULATION STRENGTH

>6.0 KV ASTM D149
OPERATING TEMPERATURE -45~200 C

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Standard thickness = 1mm